Ijraset Journal For Research in Applied Science and Engineering Technology

Abstract

The size of the electronic instruments as day by day decreases drastically and simultaneously the number of functions per chip increases hugely. So, it’s a great challenge to remove the heat generated by the chip efficiently. Many kinds of research works are going on in this direction for the past few decades. In this study the cooling effects of the chip are analyzed using CFD simulations. The single chip module is modelled using space claim. The analysis is carried out in static module by solving the governing equations for a flow through a channel via obstruction. The laminar flow is assumed for the temperature variation analysis in the chip. The three metals are copper, aluminium and silver are analyzed for temperature variation in chip. Form this analysis it was found that silver is the best metal to transfer the heat from the chip.

Introduction

I. INTRODUCTION

Since the development of the first electronic digital computers in the 1940s, the effective removal of heat has played a key role in ensuring the reliable operation of successive generations of computers. The Electrical Numerical Integrator and Computer (ENIAC), dedicated in 1946, has been described as a ‘‘30-ton, boxcar-sized machine requiring an array of industrial cooling fans to remove the 140 KW dissipated from its 18,000 vacuum tubes’’. In the year 1947 the first transistor was successfully demonstrated the development of generations of computers yet to come. As a replacement for vacuum tubes, the miniature transistor generated less heat, was much more reliable, and promised lower production costs.

During the 1960s small scale and then medium scale integration (SSI) and (MSI) led from one device per chip to hundreds of devices per chip. The trend continued through the 1970s with the development of large-scale integration (LSI) technologies offering hundreds to thousands of devices per chip. In 1980s with the development of very large-scale integration technologies offering thousands to tens thousands of devices per chip. It leads to be increase in temperature when the chip in working.

Conclusion

The electronic chip cooling is analyzed using computational fluid dynamics. The temperature variation in the sink of chip utilizing copper, aluminum, and silver is obtained. It is concluded that silver is the best material to remove the heat generated in the electronics compared to copper and aluminum.

References

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Copyright

Copyright © 2022 P. Siva Naga Sree , K. N Ravi Teja , B. Guru Chand, P. Harsha Vardhan Reddy, A. Rokesh Kumar , U. Mohan Sandeep . This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.